Mr. Herndon is a 1987 graduate of Purdue University, where he received his Bachelor of Science degree in Electrical Engineering. Mr. Herndon has also received his Defense Acquisition Workforce Improvement Act Level II certification in Systems Planning, Research, Development, and Engineering (1997) and level III certification in Program Management (2006).
Mr. Herndon began his civil service career at Naval Surface Warfare Center, Crane Division (NSWC Crane) as a Cooperative Engineering Education Student in 1983. Mr. Herndon is currently Program Manager in NSWC Crane’s role as the DoD’s Executive Agent Lead for Printed Circuit Board & Interconnect Technology, ensuring DoD access to trusted and affordable electronic interconnect technologies necessary for critical national defense systems and warfighter superiority.
Mr. Herndon is a member of the American Society of Naval Engineers and the Defense Acquisition Professional Community. In 2019, Mr. Herndon received a NextFlex Institute Fellow Award for his work in advancing the Flexible Hybrid Electronics (FHE) ecosystem.