Designing the Future: Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems Sponsored by Synopsys

Description

This event is now concluded!

You can watch the recording here!

Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges.  The panelists will also share their insights on chiplets and interface compatibility in addition to how DARPA’s NGMM (Next-Generation Microelectronics Manufacturing research program plans to grow the 3DHI R&D ecosystem. Whether you are an engineer or a policymaker looking to deepen your 3DHI knowledge, this panel offers insightful discussions to help anticipate and address future microelectronics design challenges for aerospace, government, and defense systems.