Monday, August 27, 2018
Time
Location
7:30 am - 4:15 pm
7:30 - 8:00 am
8:00 - 8:10 am
Major General James Boozer, USA (Ret.), Chief of Staff, NDIA
8:10 - 8:20 am
Electronics Division Executive Committe
8:20 - 9:20 am
Moderator: Kelly Hennig, Northrop Grumman
Brennan Grignon, Director, Industry Outreach DoD
Brennan Grignon, Director, Industry Outreach DoD
9:20 - 10:35 am
Moderator: Ezra Hall, GLOBALFOUNDRIES
Dr. Bill Chappell, Director, Microelectronics Technology Office, DARPA
Daniel Marrujo, Chief Strategy Officer, DMEA
Dimitri Kusnezov, Chief Scientist and Senior Advisor to the Secretary, DOE NNSA
James Kren, Deputy Director, Defense Security Service
Mike Johnson, Senior Scientist, Threat Intelligence Center, Sandia National Laboratory
Dr. Bill Chappell, Director, Microelectronics Technology Office, DARPA
Daniel Marrujo, Chief Strategy Officer, DMEA
Dimitri Kusnezov, Chief Scientist and Senior Advisor to the Secretary, DOE NNSA
James Kren, Deputy Director, Defense Security Service
Mike Johnson, Senior Scientist, Threat Intelligence Center, Sandia National Laboratory
10:35 - 10:45 am
10:45 am - 12:00 pm
Moderator: Taffy Kingscott, IBM
Dr. Vijay Balakrishna, Senior Director of Research, Infrastructure & Defense Products, QORVO
Hon. Zachary J. Lemnios, Vice President, Physical Sciences and Government Programs, IBM Research
Tom Pieronek, CTO, Northrop Grumman Aerospace Systems
Scott Orton, Vice President and General Manager, Trusted Mission Solutions, Mercury Systems
Zach Smith, Director of Government Business, Ginkgo Bioworks
Dr. Vijay Balakrishna, Senior Director of Research, Infrastructure & Defense Products, QORVO
Hon. Zachary J. Lemnios, Vice President, Physical Sciences and Government Programs, IBM Research
Tom Pieronek, CTO, Northrop Grumman Aerospace Systems
Scott Orton, Vice President and General Manager, Trusted Mission Solutions, Mercury Systems
Zach Smith, Director of Government Business, Ginkgo Bioworks
12:00 - 1:00 pm
1:00 - 2:15 pm
Moderator: Anita Balachandra, TechVision21
Dr. Norman Fortenberry, Executive Director, American Society for Engineering Education
David Isaacs, Vice President, Government Affairs, Semiconductor Industry Association
Dr. Jason Boehm, Director, Program Coordination Office, Department of Commerce
Dr. Malcolm Thompson, Executive Director, NextFlex Manufacturing Institute
Brad Botwin, Director, Industrial Studies, Bureau of Industry and Security, DOC
Dr. Norman Fortenberry, Executive Director, American Society for Engineering Education
David Isaacs, Vice President, Government Affairs, Semiconductor Industry Association
Dr. Jason Boehm, Director, Program Coordination Office, Department of Commerce
Dr. Malcolm Thompson, Executive Director, NextFlex Manufacturing Institute
Brad Botwin, Director, Industrial Studies, Bureau of Industry and Security, DOC
2:15 - 3:00 pm
Moderator: Dr. Grant Meyer, Lockheed Martin
Matthew Kay, Naval Surface Warfare Center, Crane
Peter Kielty, Corfin Industries
Brett Attaway, Director, Business Development, BRIDG
Dennis Fritz, IPC
Matthew Kay, Naval Surface Warfare Center, Crane
Peter Kielty, Corfin Industries
Brett Attaway, Director, Business Development, BRIDG
Dennis Fritz, IPC
3:00 - 3:10 pm
3:10 - 4:10 pm
Moderator: Antonio de la Serna, Draper
Dr. Tyler Lovelly, DPA Title III FPGA Lead, AFRL Space Electronics Technology
John Teifel, Technical Project Manager, Sandia National Laboratory
Geoff Tate, CEO, FlexLogix
Steve Mensor, Vice President of Marketing, Achronix
Steve McNeil, Trust Technologies Lead, Xilinx
Paul Quintana, Director of Marketing, Defense and Security, Microchip Corp
Dr. Tyler Lovelly, DPA Title III FPGA Lead, AFRL Space Electronics Technology
John Teifel, Technical Project Manager, Sandia National Laboratory
Geoff Tate, CEO, FlexLogix
Steve Mensor, Vice President of Marketing, Achronix
Steve McNeil, Trust Technologies Lead, Xilinx
Paul Quintana, Director of Marketing, Defense and Security, Microchip Corp
4:10 - 4:15 pm
Kelly Hennig, Northrop Grumman, Chair, NDIA Electronics Division