Agenda

8:00 - 8:30 Introduction from MIBP

8:30 - 12:30 Facilitated Working Groups

1. Components (e.g. Semiconductors/Microelectronics)
2. Interconnects (e.g. PCB, connectors)
3. Systems (e.g. EW, Radar, Sensors, C4, Software, Emerging Capabilities)
4. Process/Sustainment (e.g. FAR/DFAR contracting, IB investments)

Objectives of each group:

• develop root cause statements that are specific to risks/issues facing the market segment
• generic segment risks/issues and a cause-effect chain map
• mitigation recommendations for root causes and/or generic risks/issues.

12:30 1:30 Lunch on Your Own

1:30 - 3:30 Presentations From Each Working Group

3:30 - 5:00 General Discussions